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- Title
Investigations on Voids Formation in Cu-Mg Alloy During Continuous Extrusion.
- Authors
Yuan, Yuan; Li, Zhou; Xiao, Zhu; Zhao, Ziqian
- Abstract
In this article, the microstructure evolution and the formation of void defects in continuous extruded Cu-Mg alloy were investigated. The results showed that hot deformation, grain rearrangement, grain rotation, and grain boundary sliding occurred in the right-angle bending zone and extending extrusion zone. Voids formed in the extending deformation zone and grew up in the extrusion deformation core. The uncoordinated reaction of the grain boundary and dislocation blocked grain boundary slide in the triple grain boundary junctions, leading to nucleation of voids. Severe deformation and grain rearrangement resulted in the expansion of voids consequently through with the grain boundary slide.
- Subjects
MICROSTRUCTURE; EXTRUSION process; TRANSMISSION electron microscopy; ELECTRIC conductivity; COPPER-magnesium alloys
- Publication
JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2017, Vol 69, Issue 9, p1696
- ISSN
1047-4838
- Publication type
Article
- DOI
10.1007/s11837-017-2469-5