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On the Electrical Resistance Relaxation of 3D-Anisotropic Carbon-Fiber-Filled Polymer Composites Subjected to External Electric Fields.
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- Membranes, 2021, v. 11, n. 6, p. 412, doi. 10.3390/membranes11060412
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Study on creep characterization of nano-sized Ag particle-reinforced Sn–Pb composte solder joints.
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- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 3, p. 256, doi. 10.1007/s10854-009-9902-7
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Effects of small amounts of Ni/P/Ce element additions on the microstructure and properties of Sn3.0Ag0.5Cu solder alloy.
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- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 10, p. 1008, doi. 10.1007/s10854-008-9826-7
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Investigation on impact strength of the as-soldered Sn37Pb and Sn3.8Ag0.7Cu solder joints.
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- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 6, p. 499, doi. 10.1007/s10854-008-9757-3
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- Article
Effect of rare earth addition on shear strength of SnAgCu lead-free solder joints.
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- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 2, p. 186, doi. 10.1007/s10854-008-9696-z
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- Article
Creep property of composite solders reinforced by nano-sized particles.
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- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 4, p. 349, doi. 10.1007/s10854-007-9327-0
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- Article
Anisotropic Printed Resistor with Linear Sensitivity Based on Nano–Microfiller‐Filled Polymer Composite (Adv. Electron. Mater. 11/2021).
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- Advanced Electronic Materials, 2021, v. 7, n. 11, p. 1, doi. 10.1002/aelm.202170050
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- Article
Anisotropic Printed Resistor with Linear Sensitivity Based on Nano–Microfiller‐Filled Polymer Composite.
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- Advanced Electronic Materials, 2021, v. 7, n. 11, p. 1, doi. 10.1002/aelm.202100581
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- Article
Effect of Powder Morphologies on the Property of Conductive Silicone Rubber Filled with Carbonyl Nickel Powder.
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- Journal of Electronic Materials, 2017, v. 46, n. 11, p. 6306, doi. 10.1007/s11664-017-5601-y
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- Article
Resistance Changes in Eutectic Sn-Bi Solder Joints During Electromigration.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2756, doi. 10.1007/s11664-009-0944-7
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- Article
Effect of Thermal Aging on Impact Absorbed Energies of Solder Joints Under High-Strain-Rate Conditions.
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- Journal of Electronic Materials, 2009, v. 38, n. 10, p. 2132, doi. 10.1007/s11664-009-0872-6
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- Article
Study of Solidification Cracks in Sn-Ag-Cu Lead-Free Solder Joints.
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- Journal of Electronic Materials, 2009, v. 38, n. 9, p. 1906, doi. 10.1007/s11664-009-0839-7
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- Article
Constitutive Relations for Creep in a SnCu-Based Composite Solder Reinforced with Ag Particles.
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- Journal of Electronic Materials, 2009, v. 38, n. 9, p. 1866, doi. 10.1007/s11664-009-0840-1
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- Article
Comparison of Impact Toughness and Fracture Morphologies Between Pb-Containing and Pb-Free Solder Joints Subject to the Charpy Impact Test.
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- Journal of Electronic Materials, 2008, v. 37, n. 10, p. 1631, doi. 10.1007/s11664-008-0506-4
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- Article
Effects of Rare-Earth Addition on Properties and Microstructure of Lead-Free Solder Balls.
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- Journal of Electronic Materials, 2008, v. 37, n. 7, p. 975, doi. 10.1007/s11664-008-0454-z
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- Article
Effects of Trace Amounts of Rare Earth Additions on Microstructure and Properties of Sn-Bi-Based Solder Alloy.
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- Journal of Electronic Materials, 2008, v. 37, n. 7, p. 982, doi. 10.1007/s11664-008-0458-8
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- Article
Creep Properties of Composite Solders Reinforced with Nano- and Microsized Particles.
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- Journal of Electronic Materials, 2008, v. 37, n. 4, p. 507, doi. 10.1007/s11664-007-0208-3
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- Article
Microstructure Evolution of SnAgCuEr Lead-free Solders Under High Temperature Aging.
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- Journal of Electronic Materials, 2008, v. 37, n. 1, p. 2, doi. 10.1007/s11664-007-0263-9
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- Article
Comparative Study of Microstructures and Properties of Three Valuable SnAgCuRE Lead-Free Solder Alloys.
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- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1095, doi. 10.1007/BF02692572
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- Article
Effect of Rare Earth Element Addition on the Microstructure of Sn-Ag-Cu Solder Joint.
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- Journal of Electronic Materials, 2005, v. 34, n. 3, p. 217, doi. 10.1007/s11664-005-0207-1
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- Article
Constitutive Relations on Creep for SnAgCuRE Lead-Free Solder Joints.
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- Journal of Electronic Materials, 2004, v. 33, n. 9, p. 964
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- Article
Study on Cu Particles-Enhanced SnPb Composite Solder.
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- Journal of Electronic Materials, 2004, v. 33, n. 3, p. 218, doi. 10.1007/s11664-004-0183-x
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Investigation on the blooming behavior of additives in nitrile butadiene rubber at elevated temperature.
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- Polymer Engineering & Science, 2024, v. 64, n. 8, p. 3596, doi. 10.1002/pen.26786
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- Article
Oxidization-Induced Tin Whisker Growth on the Surface of Sn-3.8Ag-0.7Cu-1.0Er Alloy.
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- Metallurgical & Materials Transactions. Part A, 2009, v. 40, n. 8, p. 2016, doi. 10.1007/s11661-009-9871-8
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- Article
Lead-free solders with rare earth additions.
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- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2009, v. 61, n. 6, p. 39, doi. 10.1007/s11837-009-0086-7
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Simplified finite element method for resistance response of graphene composites considering size distribution and agglomeration.
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- Journal of Materials Science, 2023, v. 58, n. 40, p. 15696, doi. 10.1007/s10853-023-08968-5
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- Article
Influence of Deposition Patterns on Distortion of H13 Steel by Wire-Arc Additive Manufacturing.
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- Metals (2075-4701), 2021, v. 11, n. 3, p. 485, doi. 10.3390/met11030485
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- Article
Investigation of ethylene glycol, α-terpineol, and polyethylene glycol 400 on the sintering properties of Cu–Ag core–shell micro/nano-mixed paste.
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- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 21, p. 1, doi. 10.1007/s10854-023-10965-y
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Potential temperature sensing of oriented carbon-fiber filled composite and its resistance memory effect.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 10, p. 9612, doi. 10.1007/s10854-019-01295-z
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- Article
Electric anisotropy of carbon fiber-filled conductive composite vulcanized in electric field.
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- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 4, p. 3637, doi. 10.1007/s10854-016-5968-1
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- Article
Comparison of drop performance between the Sn37Pb and the Sn3.8Ag0.7Cu solder joints subjected to drop test.
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- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 3, p. 292, doi. 10.1007/s10854-010-0131-x
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- Article
Investigation of the fracture morphologies of Sn3.8Ag0.7Cu joints under high-velocity conditions.
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- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 10, p. 1076, doi. 10.1007/s10854-010-0093-z
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- Article
Investigation of rare earth-doped BiAg high-temperature solders.
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- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 9, p. 875, doi. 10.1007/s10854-009-0010-5
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- Article
Effects of Copper(II) Oxide on the Co-Pyrolysis of Waste Polyester Enameled Wires and Poly(vinyl chloride).
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- Polymers (20734360), 2024, v. 16, n. 1, p. 27, doi. 10.3390/polym16010027
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- Article
Effects of electromigration on resistance changes in eutectic SnBi solder joints.
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- Journal of Materials Science, 2011, v. 46, n. 10, p. 3544, doi. 10.1007/s10853-011-5265-6
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- Article
Influences of Bi<sub>0.75</sub>Y<sub>0.25</sub>O<sub>1.5</sub> addition on the microstructure and ionic conductivity of Ce<sub>0.8</sub>Y<sub>0.2</sub>O<sub>1.9</sub> ceramics.
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- International Journal of Applied Ceramic Technology, 2021, v. 18, n. 4, p. 1153, doi. 10.1111/ijac.13746
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- Article