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- Title
New approach for the preparation of nanoporous polyorganosilicate low‐k films.
- Authors
Kai Xi; Rui Guo; Yangyang Weng; Hui He; Qiang Shao; Jie Cai; Qingmin Chen; Xuehai Yu; Xudong Jia
- Abstract
The distribution of pores and the mechanical properties of materials are the key factors in preparing satisfactory low‐k films. In the present study, a kind of silsesquioxane‐polyethylene glycol (SSQ‐PEG) was synthesized and used as a template to make the distribution of pores more even in the low‐k films. The crosslinking density of films could be adjusted by the sol‐gel of tetramethoxysilane/dimethoxydimethylsilane with various proportions. The porosity of films could also be adjusted with different proportions of pendant PEG chains introduced. A dielectric constant as low as 2.1 had been achieved for nanoporous polyorganosilicate films with good tenacity. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 103: 1238–1243, 2007
- Subjects
POLYETHYLENE glycol; POLYOLS; ETHYLENE glycol; CROSSLINKING (Polymerization)
- Publication
Journal of Applied Polymer Science, 2007, Vol 103, Issue 2, p1238
- ISSN
0021-8995
- Publication type
Article
- DOI
10.1002/app.24646